A Pilgrimage To The Maker Mecca
When I arrived in Shenzhen this week to participate in Intel IDF 16, I hoped to learn more about the roaring technological innovation happening in this unique city. This is part III in my series documenting aspects of my brief trip to the city of makers this week. Read part II here and Part I here.
Developed By You
The ultimate purpose of my visiting Shenzhen, aside from meeting with a few interesting partners and customers, was to give two talks at Intel IDF 16 on topics relating to Intel’s Inventor Platforms and the results of research I have been doing with customers on their experience productizing on the Intel Edison compute module. Being new to Shenzhen, it was fascinating to see what the local “players” in the maker space where up to.
A few interesting items were announced at the keynote including a beta of the Intel Curie module software experience (variously described as a BSP or an ODK aka Open Developer Kit) and a new robotics kit based on Intel RealSense and the UP Board from AAEON. There were other announcements as well relating to Intel 3D XPoint Memory. [Read more…]